2026.1.12 Mr. Takeshi Kido from our laboratory received the IES Students & Young Professionals Paper Assistance (IES-SYPA) award at the international conference SII 2026.

Conference: SII 2026

Award: IES Students & Young Professionals Paper Assistance (IES-SYPA)

(IEEE Industrial Electronics Society, IES)

Title: Modeling and Evaluation of Soft Gears for Wearable Robots

Authors: Takeshi Kido, Keisuke Osawa, Kiyotaka Ikejo (Hiroshima University), Akio Ueda (Amtec Co., Ltd.), D.S.V. Bandara, Jumpei Arata, Eiichiro Tanaka (Waseda University)

Presentation Date: January 12

Website: https://sice-si.org/SII2026/syp-forum/